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To seize the opportunities presented by the development of Europe's intelligent automotive industry, open up channels for Chinese intelligent driving and intelligent cockpit companies to enter the German market, conduct in-depth benchmarking against leading German OEMs, top-tier chip supply chains, and the Industry 4.0 smart manufacturing system, and establish a regular exchange and cooperation mechanism between Chinese and German government, industry, academia, and research institutions, we are launching the “Smart Connectivity China-Europe · In-Depth Study Tour of the German Intelligent Automotive Industry.” Scheduled from August 31 to September 5, 2026, in Munich and Stuttgart, Germany, the study tour will feature site visits, closed-door seminars, and targeted supply-demand matchmaking with relevant government agencies, industry associations, universities, dealers, as well as local OEMs, chip companies, and renowned component manufacturers. Focusing on core topics such as intelligent cockpits, high-level autonomous driving, cloud service providers, in-vehicle connectivity, automotive-grade chips, data compliance, and overseas localization, the tour aims to comprehensively empower domestic intelligent automotive companies to explore the European market, facilitating mutual technological learning, industrial synergy, and resource sharing.

I. Overall Study Tour Arrangements

Dates: August 31, 2026 (Monday) – September 5, 2026 (Saturday)
Cities: Munich, Stuttgart
Scale: High-end industry research delegation of 15–20 participants
Proposed Chinese Participants: Companies in intelligent driving, intelligent cockpits, and core components
Proposed German Participants: Regulatory and certification authorities/government agencies, technical executives from German OEMs, core component companies, industry associations, and technology R&D institutions

II. Five Core Highlights of the Study Tour

1. Comprehensive and Targeted Matchmaking Across Government, Industry, Academia, and Research
We will invite German local government agencies, automotive regulatory and certification authorities, technical executives from leading German OEMs, global leading automotive chip suppliers, local industry associations, and cutting-edge research institutes, covering the entire value chain of policy, vehicle manufacturing, components, and research. We will provide one-on-one matching to address enterprises' overseas cooperation needs, enabling high-quality, targeted business negotiations.

2. Focus on Core Tracks of Intelligent Mobility, Directly Addressing Key Challenges in Going Global
The entire tour will feature dedicated seminar sessions centered on the three core tracks: intelligent driving, intelligent cockpits, and in-vehicle connectivity. We will systematically address key challenges such as European market access regulations, cross-border data compliance, local supply chain development, overseas market entry, and technology adaptation. We will directly tackle the core pain points for Chinese intelligent technology companies entering the German market and deliver actionable cooperation plans.

3. On-Site Visits to Smart Factories of Leading OEMs, Benchmarking Against Cutting-Edge Industry 4.0 Systems
Participants will visit the smart factories of BMW, Mercedes-Benz, and Porsche, gaining an up-close view of German Industry 4.0 digital production lines, digital twin R&D systems, and the entire process of intelligent vehicle testing and mass production. This will provide direct insight into the advanced models of intelligent R&D, flexible manufacturing, and digital management employed by the world's top OEMs.

4. In-Depth Exchanges with Leading Automotive Chip Companies, Opening Up Upstream Supply Chain Cooperation Channels
We will visit the R&D centers and production facilities of two global automotive chip leaders — NXP Semiconductors and Infineon Technologies — to conduct technical exchanges on high-level autonomous driving chips, in-vehicle computing platforms, and automotive-grade safety hardware. This will help domestic intelligent cockpit and autonomous driving companies establish stable cooperation channels with Europe's upstream chip supply chain.

5. Learning from Benchmark Chinese Companies with Successful Overseas Operations, Replicating Proven Localization Strategies
Participants will visit XPeng's German R&D Center in Munich for in-depth exchanges on the localization and operational experience of Chinese intelligent automotive technology going global. They will learn about the mature “Chinese self-developed intelligent solutions + German local adaptation” model and draw on practical experience in overseas R&D, channel expansion, and customer operations to mitigate overseas business risks.

III. Study Tour Itinerary (Provisional)

Note: The itinerary is subject to adjustments based on actual enterprise matchmaking needs and the reception arrangements of German partners to ensure the quality of visits and matchmaking.

IV. Target Participants for Recruitment

This study tour is open to domestic enterprises across the intelligent automotive industry chain and core component sectors. We sincerely invite senior executives from companies with technology, products, or overseas expansion needs to participate:

1. Vehicle Manufacturers: Overseas expansion leads and technology R&D heads from new energy passenger vehicles, intelligent commercial vehicles, and autonomous driving brands;

2. Intelligent Cockpit / Autonomous Driving Companies: R&D enterprises in high-level autonomous driving solutions, in-vehicle cockpit systems, human-machine interaction, domain controllers, and perception hardware;

3. Core In-Vehicle Components: Companies in automotive-grade chips, in-vehicle sensors, thermal management, and in-vehicle electronic hardware and software;

4. Connected Vehicles and Data Services: Technology providers of in-vehicle operating systems, connected vehicle platforms, data security, in-vehicle software, and intelligent connected vehicle services;

5. Overseas Support Service Providers: Automotive testing and certification, overseas channel operations, intelligent automotive manufacturing equipment, and overseas industrial investment institutions.

V. Registration

Enterprises interested in participating in this China-Germany intelligent mobility technology exchange study tour can secure their spots now. Only 20 spots are available. Registration Deadline: July 24, 2026.

Contact Person: Dai Xinglong
Phone: 18261521285
Email: daixinglong@chinaev100.org